Publish Time: 2025-11-22 Origin: Site
Skived heat sinks deliver the highest cooling performance in the smallest footprint — with zero thermal interface between base and fins. Perfect for high-power CPUs, GPUs, IGBTs, 5G gear, and LED systems.
A skived heat sink is machined from a single solid block of copper or aluminum. Ultra-thin fins are precisely “shaved” and bent upward, creating a true one-piece cooler with no bonds, solder, or epoxy between fins and base — eliminating the biggest thermal bottleneck in traditional heat sinks.
Start with a high-purity copper (C11000) or aluminum (1050/6063) block
A razor-sharp tool slices and simultaneously lifts each fin
Hundreds of passes create dense, tall, perfectly straight fins
Final machining, surface treatment, and quality checks
No dies, no tooling charges, and extreme precision — fins as thin as 0.2 mm with gaps under 0.5 mm are routine.
Zero interface resistance = heat flows instantly from base to every fin tip. Real-world tests show 15–30 % lower thermal resistance than bonded-fin designs of the same size.
Up to 50:1 aspect ratio and >30 fins per inch — far beyond extrusion limits (typically<10:1 and ~12 fins/inch).
No expensive custom dies. Easy to add cutouts, mounting holes, heat pipes, or vapor chambers post-skiving.
No joints to fail under thermal cycling or vibration — ideal for telecom, automotive, and aerospace.
| Feature | Skived | Extruded | Bonded Fin |
|---|---|---|---|
| Thermal Resistance | Lowest | Medium | Higher (interface penalty) |
| Fin Density | Very High | Low | High |
| Tooling Cost | None | High (custom die) | Low–Medium |
| Best For | High power density | Cost-sensitive volume | Very large coolers |
Copper (~400 W/m·K): Ultimate performance, especially when spreading heat across a large base. Worth the weight & cost in servers, high-end GPUs, and power modules.
Aluminum (~220 W/m·K): ~1/3 the weight, lower cost, excellent corrosion resistance — perfect for most applications.
High-performance CPUs & GPUs (data centers, workstations)
IGBTs & SiC MOSFETs in EV inverters and motor drives
5G base stations and RF amplifiers
High-power LED COB arrays
Telecom switches and optical modules
Higher cost than simple extrusions (but often cheaper than liquid cooling)
Thin fins require careful handling
Best with forced airflow — less ideal for pure natural convection
Calculate total heat load (W)
Define max component temperature
Measure available space & airflow (LFM or CFM)
Decide copper vs. aluminum
Specify mounting, cutouts, and surface finish
When maximum cooling in minimum space is non-negotiable, skived heat sinks are the clear winner. No other air-cooling technology matches their combination of thermal efficiency, fin density, and one-piece reliability. For any project pushing the limits of power density, skived is the proven path to lower temperatures, higher speeds, and longer component life.
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