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Cooling solutions for PV inverters

Inverters are also called power regulators. The process of converting DC power into AC power is called invert. The circuit that can realize the inverting function is called an inverter circuit. A device that can realize the inverting process is called an inverting device or inverter. In a solar energy generation system, the inverter efficiency is an important factor that determines the solar cell capacity and the storage battery capacity. The breakdown of PV inverter will cause the PV system to shut down and this directly leads to the loss of power generation. Therefore, high reliability is an important technical indicator for PV inverters.
The good cooling of PV inverters is an important criterion to ensure the high reliability of its operation. Therefore, it is recommended to carry out thermal simulation in the beginning of PV inverter's design stage and this has become the first issue to be considered by PV inverter manufacturers. As one of the professional high power cooling manufacturers in China, Winshare Thermal has an outstanding thermal design and development team, which owns the capability of carrying out reliable thermal simulation and testing. We have collaborated with several domestic and overseas PV inverter manufacturers on the cooling technology for inverters and have been supplying services and supports with our professional cooling technology.

Assuming a system impedance of 80 Pa, the fan curve through the heat sink can be adjusted as follows.

The top left figure is the schematic of the internal structure and heat-dissipating devices of the Infineon IGBT

 
 
 
 
 
 
 
Diode:59W;
IGBT:124.5W; 
Total:1100WW;
Assuming the thermal interface material is 0.15mm 
Thick with a thermal conductivity of K=3W/m*K

Schematic of the simulation model of the heat sink solution and its parameters:

 
 
Heat sink parameters:
Dimensions: W236*L200*H304mm
Fin :
Thickness: 0.6mm
Fin gap: 3.0mm
Fin count: 77fins
Heat pipe parameters:
DD8 sintered tube or groove structure;
24 pcs of U-shaped heat pipes (single-layer layout) and 48 pcs of L-shaped heat pipes (dual-layer layout) are used
4258 low-temperature solder paste is used for soldering;
Base: Al plate + copper plate (IGBT heat source area)
The design with a single layer of heat pipes has a lower cost and higher cooling performance as compared to dual layers of heat pipes.

Summary of the simulation data of the cooling solution for the PV inverter:

Solution

Ta

Power

H.S 
Tb max

H.S 
DT

NTC1

NTC2

NTC3

Fan 
working point

Al base+
copper block

55

IGBT/3pcs
1100W/each
Reactor
700W

85.1

28

87.6

88.1

87.5

1127.5
m^3/Hr
215Pa

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