Precision Thermal Modules for Next-Gen AI Power

High-density AI power and next-generation accelerators drive extreme thermal loads that traditional cooling cannot manage. Winshare Thermal delivers the necessary precision thermal control by engineering robust Thermal Modules specifically for these challenges. Our vertically integrated solutions range from advanced heat pipe thermal modules and precision skived fin heatsinks for forced air applications to high-performance brazed and FSW liquid cold plates for direct-to-chip cooling. Leveraging our expert design team and comprehensive simulation analysis, we custom-engineer these modules for optimal thermal transfer at the component level (GPUs, CPUs, IGBTs). This ensures maximum speed, dependability, and energy efficiency for your most demanding AI servers, high-power computing, and new energy system deployments.

Advanced Heatsink Technologies for AI Infrastructure

Winshare Thermal engineers precision air-cooled thermal modules for high-power density challenges by leveraging our expert design team and advanced thermal simulation analysis. We design and manufacture a comprehensive portfolio of high-performance heatsinks—including skived fin, FSW, and heat pipe thermal modules—using vertically integrated in-house production. Our solutions effectively dissipate extreme heat from high-wattage components (like server CPUs and IGBTs), maintaining optimal operating temperatures and ensuring superior system reliability. Winshare Thermal is a trusted leader among thermal management companies, known for delivering highly customizable and robust air-cooled solutions that meet the rigorous demands of new energy, data center, and next-generation AI applications.

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End-to-End Liquid Cooling for Diverse AI Infrastructure

Winshare Thermal cools high-power infrastructure from the component to the container by engineering liquid cooling solutions tailored to diverse new energy and data center environments. We dissipate extreme heat in multi-IGBT power modules, handle high-throughput workloads in server racks, and ensure consistent performance in systems operating in remote or harsh conditions (like outdoor PV inverters or EV controllers). In high-density installations, we maximize thermal performance in cabinets where power and space constraints are critical. Our end-to-end liquid solutions—from precision cold plates to multi-cabinet container systems—adapt to varying form factors and thermal loads to deliver reliable, efficient cooling that enables scalable high-power deployments.

Advanced Heat Sinks and Assemblies

Winshare Thermal Heat SinkTechnology Highlights

Skived Fin Heat Sink

AI large model training (e.g., GPT-5, ) and cloud inference computing centers are characterized by high-density cabinet deployment and continuous full-load operation.(e.g., NVIDIA B200 1800-2000W, and B300 >2500W). Traditional heatsinks fail to meet temperature control requirements. Skived fin heat sinks achieve ultimate cooling performance through the seamless integration of fins and substrate, perfectly solving the four core pain points of AI services: high heat flux, low thermal resistance, miniaturization, and high reliability. By fundamentally eliminating the contact thermal resistance of traditional heat sinks (Rth= 0.02°C/W), they break through the high-power dissipation bottleneck of AI. Having deeply penetrated the core links of the entire AI service industry chain, skived fin heat sinks have become the most mainstream application (GPU/CPU/TPU) in AI servers.

Heat Pipe Heat Sink

Through its exceptional temperature uniformity, heat pipe heat sinks ensure a uniform temperature field during chip testing, thereby enhancing test accuracy and chip yield. As a revolutionary technology enabling "long-distance, high-efficiency, and low-power" thermal management in AI service products, heat pipe heat sinks leverage the principle of phase-change heat transfer and continuous technological advancements (such as vapor chambers (VCs) and micro heat pipe arrays). Their thermal conductivity exceeds that of pure copper by hundreds of times, perfectly addressing the dual challenges of high heat flux density and space constraints faced by AI chips, servers, and computing clusters. Consequently, they have established themselves as one of the core pillars in the thermal management solutions for current high-end AI equipment.

Integrated Heat Sink

Integrated heat sinks employ monolithic forming processes, such as die casting, extrusion, and welding, to fabricate the cooling fins and substrate (or product housing) as a single, unified entity. This approach optimizes the thermal path from the design stage, minimizing the contact thermal resistance and space footprint inherent in traditional cooling solutions that rely on assembled components. Simultaneously, it enhances the overall structural integrity and reliability. Playing an irreplaceable role in applications like AI chips, servers, and computing clusters（NVIDIA H100/A100、AMD MI300）, integrated heat sinks have established themselves as one of the mainstream cooling solutions for high-end AI equipment.

Winshare Thermal Liquid Cooling Technology Highlights

Brazed Cold Plate

The core challenge of AI servers lies in the surging power density of chips (single GPU power consumption exceeding 700W, heat flux density reaching 350~500W/cm²), high-density integration of computing power, and stringent requirements for long-term stable operation. Brazed cold plates, is tailored to meet the cooling demands of AI chips (GPU/TPU/NVIDIA H100/GB200) characterized by ultra-high power density and 7×24h uninterrupted operation.Brazed cold plates rapidly dissipate the heat directly from the chips through internal coolant circulation. This prevents excessive junction temperatures that could lead to computing power throttling or chip damage. As a key solution to overcome the bottlenecks of air cooling and unlock the full potential of AI computing power, brazed cold plates have become the mainstream standard for liquid cooling in high-end AI servers.

FSW Cold Plate

FSW water cooling, with its ultra-high sealing reliability and precise temperature control capability, ensures the temperature fluctuation of AI chips during full-load operation is controlled within an extremely small range, thus ensuring the stability and sustainability of the computing power output, significantly improving the training efficiency large models and the long-term service life of chips. It is the core supporting technology for AI service products to achieve "high density, low leakage, and long endurance" cooling By constructing an integrated sealed flow channel through solid-phase welding process and upgrading the detailed flow channel design (such as micro-channel array, partition temperature control flow channel, etc), its thermal exchange efficiency is more than 30% higher than traditional water cooling. It can efficiently cope with the dual challenges of ultra-high heat flow density and compact space of AI chips, high-density computing power clusters, and liquid cooling servers, and it is one of the key core components in the current all-liquid cooling computing center architecture.

Manifold

The core requirements of AI servers include collaborative cooling of multiple chips, high-density computing power integration, and room-level large-scale deployment.Compared with traditional decentralized liquid cooling connection solutions, Manifold, which is tailored to the high-density, high-reliability and large-scale operation needs of AI servers, is integrated inside the chassis of AI servers. It connects multiple cooling terminals such as GPU/TPU cold plates, power supply cold plates and memory module cold plates. With precise flow distribution, it ensures consistent cooling performance across multiple chips. Its highly efficient and simplified connection and deployment scheme is well-suited for the high-density integration of AI computing power. Endowed with flexible and ultra-strong system scalability as well as reliable operation guarantees, Manifold addresses the thermal management challenges of multi-chip and multi-node systems, and serves as a critical component driving the large-scale and high-efficiency operation of AI computing clusters.

Liquid Cooling Modules and Solutions for AI Efficiency

Artificial Inataelligence Cooling FAQ

Winshare Thermal for Artificial Intelligence Cooling Solutions

Winshare Thermal provides proven reliability driven by decades of high-power cooling experience and an ISO-certified quality management system. Our liquid cooling and thermal module solutions are engineered to maximize AI server performance without compromise.

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