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Liquid cooling technology

Liquid cooling technology is a heat dissipation technology that uses the flow of liquid to quickly take away heat. Liquid cooling application refers to the use of liquid cooling plates (also called water cooling plates, liquid cooling radiators) installed at the heat source, together with heat exchangers and heat exchange pumps, to dissipate heat in a liquid circulating flow. In general, liquid cooling technology is used in environments where forced convection or phase change systems cannot achieve heat dissipation effects with extremely high thermal energy density.
Winshare Thermal continues to increase the research and development of liquid cooling technology, especially the continuous innovation in the production process of water cooling products. It has obtained multiple technical patents in the automatic bending of copper pipes, extrusion dies, pressure pipes, adhesion welding and other technical processes. This makes the welding of the water-cooled plate more stable, greatly reduces the water leakage of the water-cooled plate, and improves the reliability of the heat dissipation of the water-cooled plate; technical treatment is performed on the surface of the liquid-cooled plate to achieve better contact with the heat source and improve the heat dissipation efficiency.

Winshare Thermal provides a variety of water-cooled heat dissipation structure types to choose from

  Buried pipe forming water-cooled runner + pipe joint
  Profile extrusion molding water-cooled runner + welding
  Machine-added water-cooled runner + welding
   Die-casting water-cooled runner + welding

SVG water cooling solution

SVG customers provide drawings and requirements:
Technical Description:
(1) The heat dissipation power of the designed water-cooled radiator is 920w×2=1840w;
(2) Pressure ≤7bar/30min, no leakage;
(3) Operating environment temperature: -45℃ to 45℃;
(4) Flow resistance of water-cooled plate: <50KPa, 11L/min, volume density: 50% water + 50% glycol solution;
(5) The inlet temperature is 60℃, the highest surface temperature is lower than 90℃, and the temperature difference is 3℃.

Schematic diagram of SVG water-cooled radiator simulation design model and related parameters:

Thermal design parameters:

Adopt water cooling method, material is AL6063-T6, flow resistance of water cooling plate: <50KPa, 11L/min, volume density: 50% water + 50% glycol solution; inlet temperature is 60℃, there is no between water cooling plate and IGBT medium.

Schematic diagram of the simulation results of the cross-sectional temperature loss of the water-cooled plate:

The inlet temperature is: 60℃;
The outlet temperature is: 63.84 ℃;
Volume flow: 11L/min.

Schematic diagram of simulation results of cross-sectional pressure changes in water-cooled plates

Inlet pressure: 102727.78Pa;
Outlet pressure: 101325.02Pa;
Pressure drop: 1402.76Pa.

Schematic diagram of simulation of temperature change of IGBT water-cooling plate shell

The highest temperature is: 85.25℃;
Temperature difference of water-cooled plate: 83.22℃-82.39℃=0.83℃,
Less than the required 3℃, meeting the design requirements.

Thermal simulation data summary

Cooling solution 50% water +50% ethylene glycol IGBT core temperature ℃
Maximum temperature of water cooling plate Volume flow Inlet temperature Pressure drop #1 #2 Temperature difference
Water cooling plate 85.25℃ 11L/min 60℃ 1402.8Pa 82.39 83.22 0.83

Water cooling solutions provide joint options

The water-cooled heat dissipation solution provides pipeline options

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