Thermal Performance Thermal resistance as low as 0.01 °C/W By optimizing the internal runner structure, material selection, and surface treatment, excellent heat transfer efficiency is achieved, ensuring that the temperature of the heating device is effectively controlled.
Size and shape customization Maximum size 600mm x 600mm
According to the package size, heat dissipation requirements and internal space constraints of different heating devices (such as CPUs, GPUs, IGBTs), complex customizations such as arbitrary shapes, openings, integrated mounting points, and multi-layer stacking can be carried out.
Pressure Drop It can be optimized according to the needs of the system
While ensuring efficient heat dissipation performance, the flow channel optimization design minimizes the resistance of coolant flowing through the water block, thereby reducing the power consumption and noise of the water pump and improving the overall energy efficiency of the system.
Flow Rate Customized design to meet system requirements
Accurately match the coolant flow required by your liquid cooling system design and total heat load to ensure that the coolant can effectively remove heat and avoid local overheating or undercooling.
Surface Flatness Better than 0.01 mm
Through high-precision CNC machining and fine grinding, the contact surface between the water block and the heating device is ensured to be extremely flat, minimizing the contact thermal resistance and improving the thermal conductivity efficiency.
Operating Pressure Up to 200 PSI
The robust structural design, reliable welding/brazing process, and strict seal testing ensure the safe and stable operation of the water block in the high-pressure liquid cooling system, eliminating the risk of leakage.