We drill deep, exact holes into a solid copper or aluminum block. Channels go any way you need. Even cross or stack. Coolant runs right under the heat.
Core Features:
One solid block: No welds. No joints. Zero leaks.
3D channels: Cross, layer, or curve to match heat.
Exact placement: Coolant sits at heat center.
Max surface: More wall contact. Fast heat grab.
Tough build: Full metal. Handles extreme conditions.
Advantages:
Zero leaks: One solid block. No welds. No joints.
Perfect fit: Channels match your heat spots exactly.
Max cooling: 3D flow paths. Lowest thermal resistance.
High heat ready: Handles extreme power density.
Strong build: Full metal. Survives tough conditions.
Custom shape: Any layout. Works for AI chips, EV power modules.
We stamp high-density fins. We place them in grooves on a machined base plate. We bond or vacuum braze them tight. A sealed cover closes the flow path. Coolant runs through the fins. Heat leaves fast.
Core Processes:
Vacuum Brazing: Filler metal melts in vacuum. Joins fins to base. Strong bond. Very low heat resistance.
Epoxy Bonding: High-conductive glue. Simple. Low cost. Good for lighter cooling needs.
Advantages:
3-5x more surface: Fins give huge contact area inside.
Strong turbulence: Breaks heat barrier. High heat transfer.
Extreme power: Best for high heat flux. Over 1000 W/cm².
Leak-free seal: Full braze or bond. No weak points.
Custom fin layout: Match any heat pattern.
Light & efficient: Aluminum fins + copper base option.
Trusted build: ISO 9001 & TS 16949 certified. Used by BYD, Delta.
We make water blocks to cool hot parts like CPUs, GPUs, IGBTs, or battery packs. The block sits tight on the heat source. Coolant flows inside special channels. Heat moves fast to the liquid.
Core Features:
Direct fit: Sits right on heat source. Fast heat move.
Smart channels: Pins or fins inside. More contact area.
Strong cooling: Liquid takes big heat loads.
Keeps parts cool: High-power devices stay in safe range.
Full custom: Any size, shape, or port you need.
Advantages:
Direct touch: Lowest heat resistance. Fast cooling.
High power ready: Handles CPUs, GPUs, EV batteries, servers.
Smart channels: Micro fins or pins boost heat pickup.
Guangdong Winshare Thermal Technology Co,Ltd. Founded in 2009 focused on high-power cooling solutions for the development, production and technical services, committed to becoming a new energy field thermal management leader for the mission.