Customized High-density Copper/aluminum Skived Fin Microchannel Liquid Cold Plate Heat Sink for Microprocessors, High Vacuum Brazing Part

Core advantages:

Process Breakthrough: Integrated Skived Fin Forming (eliminates contact thermal resistance, boosting heat dissipation response by 25%)

Structural Advantage: Dense-Thin Fin Structure (increases heat dissipation area by 40% compared to traditional solutions)

Material Superiority: AL1060/C1100 Grade Aluminum (thermal conductivity ≥201W/(m·K), excelling in both lightweight design and corrosion resistance)

High-Power Compatibility: Ideal for high-heat-flux scenarios (meets the thermal demands of lasers, computing centers, and intelligent driving domain controllers)