Today's most demanding high-performance electrical and technological applications are possible thanks in large part to innovative thermal management technologies. In applications where power output is high and space is limited, cold plates are critical due to their combination of high thermal conduc

If air cooling can no longer achieve the goal of system cooling, then liquid cooling may be a good choice. Liquid cooling is mainly achieved through cold plates, and there are many types of cold plates like Tube Liquid Cold Plate, FSW Liquid Cold Plate, Brazing Liquid Cold Plates, etc. For those int

The liquid cold plate is a heat dissipation technology that dissipates the heat and power consumption of high-power electronic components on the surface of the cold plate by arranging fluid channels inside a compact and relatively thin plate or strip of metal to allow convective heat exchange betwee

Electronic equipment is increasingly used in medical work, and their environmental requirements are more diverse and strict. Temperature is one of the most important factors, because temperature changes have the greatest impact on electronic equipment. At present, the commonly used heat dissipation

A liquid cold plate is a component that exchanges heat through liquid cooling. It is processed into a metal sheet to form a flow channel. The electronic component is installed on the surface of the plate (the middle is coated with a heat transfer medium). The cooling liquid enters from the inlet and

Semiconductor refrigeration, also known as electronic refrigeration, or thermoelectric refrigeration, is a discipline developed from the 1950s at the edge of refrigeration technology and semiconductor technology. It uses PN junctions composed of special semiconductor materials to form thermocouple p

The increase in heat load of high-power electronic equipment and the requirements of product sealing performance have changed the traditional design thinking, and liquid cooling has become the mainstream trend. Compared with traditional air-cooled radiators, liquid cooling plates have significant pe

IGBT power semiconductor modules are the core components of current power electronic devices, and the accumulation of heat will seriously affect the safety, reliability and performance of the devices. The heat dissipation problem is becoming more and more prominent, and the requirements for module c

As a relatively high-priced product, cold plate heat sinks often have better materials, and have higher requirements in terms of planning and sealing. Therefore, the price is generally higher than that of air-cooled radiators. The more expensive aluminum cold plate also has many points to pay attent