Heat Pipe Modules: The Essential Thermal Bridge in AI Server CoolingTable of ContentsI. Introduction: AI Computing's Extreme Thermal ChallengeII. Heat Pipe Module Principle: Phase Change and Ultra-High ConductivityA. The Core Advantage of Phase Change Heat TransferB. Vapor Chamber (VC) for Planar Sp

The relentless pursuit of higher performance in electronic devices, especially in areas like AI, gaming, and data centers, has pushed power densities to unprecedented levels. This concentration of heat in ever-shrinking footprints poses a formidable challenge for traditional thermal management solut

In the demanding world of modern electronics, effective heat management is paramount. As CPUs, GPUs, and other components become increasingly powerful and compact, traditional thermal solutions often struggle to prevent overheating, which can lead to performance degradation or system failure. This c

In the relentless pursuit of smaller, faster, and more powerful electronic devices, engineers face an ever-growing challenge: managing the intense heat these components generate. Traditional cooling methods, like simple conduction to a finned heat sink or basic air convection, often fall short when