Optimized Design of the Analysis of Skived Fin Heat SinkAccording to the different molding processes of the heat sink, it can be roughly divided into extrusion heat sink,skived fin heat sink, welding heat sink and so on. The more commonly used is extrusion and skived fin heat sink. The production of

How to Reduce the Production Cost of Liquid Cold PlateThe liquid cold plate is a common component in industrial cooling systems. We all want to equip our projects with high-quality cold plates and efficient heat dissipation systems to ensure that our equipment can maintain good working conditions fo

The water cooled plate is also called water cold heat sink. It is usually used on some high -power devices to play a very good heat dissipation effect. For some daily contacts, such as medical equipment, electronic equipment, industrial equipment, military equipment, laser, will use water -cooled pl

The operation of pure electric vehicles uses electricity as energy, and the vehicle is driven by an electric drive system. The thermal management system of new energy vehicles is very different from that of traditional fuel vehicles. In new energy vehicles, batteries and motors generate heat during

With the increase in the sales and ownership of new energy vehicles, fire accidents of new energy vehicles also occur from time to time. The design of thermal management system is a bottleneck problem restricting the development of new energy vehicles. Designing a stable and efficient thermal manage

Excellent thermal conductivity mainly depends on new materials with excellent performance. The operating temperature of electronic products has a great influence on its efficiency and life. Relevant studies have shown that the life of electronic products is shortened exponentially when they work at

Microchannel cooling is the etching of microscale channels on a substrate. The heat is carried away by the working fluid flowing in the microchannel after being conducted through the substrate. It is an efficient cooling method, and has great development prospects in the fields of electronic compute

"Moore's Law" accurately predicted the rapid development of the semiconductor industry, but with the rapid development of electronic packaging technology and micromachining technology, the size and integration of transistors are getting closer and closer to the physical limit. The precision of exist

At present, the theory of battery thermal management is perfected and the technology is continuously innovated. On the one hand, start with the battery's own materials to improve the high/low temperature resistance of the battery and strengthen the battery's tolerance. For example, the latest solid-