PCB is the core of electronic equipment, including resistors, chips, transistors, etc. The chip has the highest heating power. The common CPU is 70 ~ 300 W, which is the main heat source. Due to the high integration of PCB, its heating power continues to increase. Excessively high temperature is ser

Pure electric vehicles have high comprehensive energy efficiency and relatively little environmental pollution. With the continuous development of pure electric vehicle related technologies, the scale of the industry is gradually expanding. Constrained by the energy density and material properties o

High-power electronics are at the heart of applications such as electric vehicles, wind turbines, high-speed rail, and power grids. At present, high-power electronic devices are developing toward high power level and high integration. Therefore, the problem of heat dissipation is inevitably concerne

Since the semiconductor integrated circuit came into being in the late 1950s, it has been developing rapidly in the direction of small size, high speed and high memory. Under the guidance of Moore's Law, the feature size of silicon-based chips is continuously reduced and the number of transistors is

In recent years, the concept of energy saving and emission reduction has received more and more attention. In 2020, the dual carbon target was formally proposed. Against this background, the development of new energy electric vehicles in the field of transportation will also be the general trend. Li

With the continuous development of electronic technology, the integration, miniaturization and high power density of chips have become its main development direction. This puts higher demands on thermal management technology. The thermal management system of the chip is more complicated. In addition

Proton exchange membrane fuel cell (PEMFC) adopts heat management technologies such as air cooling and liquid cooling, which can effectively transfer excess heat from the battery. However, auxiliary work is required to drive the fluid flow, which undoubtedly reduces the overall power of the battery.

As the industry moves to 3D packaging and continues to scale digital logic, increasing thermal challenges are pushing the limits of research and development. Too much heat in a small space can cause real problems, such as products being too hot to hold. Overheating DRAM needs to be constantly refres

Design a liquid-cooled plate for soft-pack lithium batteries of electric vehicles. Based on the determined internal channel direction and the orthogonal test design method, CFD software is used to study and analyze the effects of coolant flow rate (V), number of runners (N), runner width (W), and ru