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server cooling system
Servers and networks
3C products are also called information home appliances, which typically mean computers, telecommunications, and consumer electronics. There are a wide variety of products with a huge demand. China has become the worldwide largest 3C consumption market for 3C products. 

It communication cooling program

3C products are also called information home appliances, which typically mean computers, telecommunications, and consumer electronics. There are a wide variety of products with a huge demand. China has become the worldwide largest 3C consumption market for 3C products. With the enhancement of the financial condition and income of our citizens, there is a higher demand for the quality of electronic products. Companies launch products with better configuration, better performance, andbetter designs in order to satisfy consumers.
 
There are a great number of factors which affect the quality of electronic products and cooling is a factor that could not be neglected. Especially after the development of the "Samsung battery-gate" event in 2016, electronics manufacturers pay more attention to the cooling performance and safety of their products. How to make sure the cooling of an electronic product meet the stringent design requirements? The best approach is to plan for thermal management at the beginning of the product design cycle so as to acquire the optimal cooling solution. Winshare Thermal is an outstanding cooling techniques supplier, who can provide the cooling solutions for IT telecommunication electronics products including mainboard cooling, CPU cooling, graphics card cooling, radio frequency module cooling,RU cooling, game console cooling, VR cooling, IPC cooling, server cooling, central variable frequency air conditioner cooling, TEC cooling, etc.

The target to be achieved by the simulation of the cooling solution:

 
PCB source temperature ≤100
CPU temperature ≤80℃

Descriptions of the heat sink cooling solution:

(1) Add an30*10mm axial fan to increase the air flow through RX module;
(2) Modify the copper fins in front of the fan in order to increase system air flow.

Schematic of the simulated temperature distribution on the top side of the RX module:

Summary of the simulation results for the cooling solution:

 

 

CPU maximum temperature
(℃)

Temperature range of the heat source
(℃)

System air flow
(ft^3/min)

Simulation results of the solution

64.43

60.92~59.43

8.4

The results meet the requirements of CPUtemperature less thanand heat source temperature less than 100℃ and the thermal design is complete.

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