| SPECIFICATIONS | DETAILED DESCRIPTION |
| Main material | High purity aluminum (AL1050, AL1070), copper (C11000) |
| Fin density | Very high density can be achieved, such as 0.5mm pitch, to optimize heat dissipation surface area |
| Fin aspect ratio | Up to 20:1 or even higher, effectively utilizing heat dissipation space |
| Maximum size | Large cooling modules can be manufactured according to customized requirements |
| Surface treatment | Black/transparent anodizing, chemical nickel plating, passivation, sandblasting, etc. to improve corrosion resistance and radiation performance |
| Thermal resistance | One-piece molding, no interface thermal resistance, the overall thermal resistance is much lower than the traditional combined heat sink |