Tel: +86-18025912990   |  Email: wst01@winsharethermal.com
You are here: Home » News » Blog » 6 Key Considerations for Heat Sink Design

6 Key Considerations for Heat Sink Design

Views: 13     Author: Site Editor     Publish Time: 2022-10-10      Origin: Site

Heat sinks transfer heat generated by an electronic component or assembly to a cooling medium. Heat is transferred from the higher temperature region (electronic component) to the lower temperature region (fluid medium) by conduction, convection, radiation, or a combination of these heat transfer methods.


The performance of this passive heat exchanger is determined by many factors, including the velocity of the coolant, thermal conductivity, thermal interface material, and connection method. For a specific application, the parameters of the heat sink can be precisely determined by modeling and analysis. Through this article, heat sink manufacturer Winshare will share with you the 6 main factors that influence the design of a heat sink.

aluminum heat sink


1. Thermal resistance

Thermal resistance is the sum of the resistance to heat flow between the mold and the coolant. These heat flow resistances include the resistance between the mold and the component housing, the resistance between the housing and the heat sink (thermal interface resistance), and the resistance between the heat sink and the fluid in motion. The thermal resistance does not affect the inhomogeneous heat distribution, and it is not suitable for modeling systems that are not in thermal equilibrium.


Although the thermal resistance value approximates, it allows for modeling and analyzing the thermal characteristics of semiconductor devices and heat sinks. The analysis of different heat sink designs is used to determine the geometry and parameters of the heat sink that will achieve the maximum heat dissipation. Complex modeling of thermal characteristics can be achieved by meshing the heat sink using 3D thermal resistance.


2. Materials

The heat sink was designed using materials with high thermal conductivity, such as aluminum and copper. Copper has excellent thermal conductivity, resistance to microorganisms, biological contamination, corrosion resistance, and heat absorption. Its properties make it an excellent material for heat sinks, but it is more expensive and denser than aluminum. Copper and aluminum heat sink each have their advantages and are the two most common types of heat sinks.


Diamond has high thermal conductivity, making it a suitable material for thermal applications. Its lattice vibrations explain its excellent thermal conductivity. Composite materials such as AlSiC, Dymalloy, and copper-tungsten pseudo-alloys are also commonly used for thermal applications.


3. Heat sink arrangement, shape, size, and position

The flow of the cooling medium is greatly influenced by the arrangement of the fins on the heat sink. An optimized configuration helps to reduce the resistance to fluid flow, thus allowing more air to pass through the radiator. Its performance also depends on the shape and design of its fins. Optimizing the fins' shape and size helps to maximize the heat transfer density.


4. Electronic Heat Dissipation Efficiency

The heat sink receives heat from the electronic device and dissipates it into the surrounding coolant. The heat transferred from the fins to the cooling medium decreases with increasing distance from the bottom of the heat sink. Using materials with higher thermal conductivity and lowering the aspect ratio of the fins can help improve the overall efficiency of the fins.


5. Thermal Interface Materials

Surface defects, roughness, and gaps increase thermal contact resistance, reduce the thermal solution's effectiveness. These defects increase the resistance to heat flow by reducing the thermal contact area between the electronic components and their heat sink, thereby reducing the heat sink efficiency. Thermal resistance is reduced by increasing the interface pressure and decreasing the surface roughness. In most cases, these resistance reduction methods have limitations. To overcome these limitations, thermal interface materials are used. When selecting a thermal interface material for a given thermal application, the resistivity of the material, the contact pressure, and the size of the surface gap should be considered.


6. Heat sink installation methods

The thermal performance of a heat sink can be enhanced by selecting the appropriate method of attaching the heat sink to an electronic device or component. The selection process should consider the thermal and mechanical requirements of the thermal management solution. Standard heat sink attachment methods include bracket spacers, flat spring clips, epoxy, and thermally conductive tape.


These are the 6 main factors that affect the heat dissipation effect when designing a heat sink. If we want to enhance the heat dissipation performance of a heat sink, the primary consideration is also the above 6 factors. If you want to optimize the heat dissipation effect of a heat sink, you can refer to them. If you still feel that you have no way to start, you can contact a message or send an email to contact Winshare, a professional industrial cooling solution provider. We can provide you with the most professional advice.


 
Tell Me About Your Project
Any questions about your project can consult us, we will reply you within 12 hours, thank you!
Send a message