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Water cooling and heat dissipation technology of IGBT

Views: 7     Author: Site Editor     Publish Time: 2022-07-09      Origin: Site

IGBT (Insulated Gate Bipolar Transistor), Insulated Gate Bipolar Transistor, is by the BJT (Bipolar Transistor) and MOS (Insulated Gate field-effect tube) composite composed of complete control voltage drive type power semiconductor devices, with a high input impedance of MOSFET and GTR low conduction of the advantages of both the pressure drop.

Liquid cooling  

GTR has low saturation voltage and high current-carrying density but high driving current. MOSFET drive power is small, the switching speed is fast, but the conduction pressure drop is large, and the current density is small. IGBT combines the advantages of the above two devices, with low driving power and low saturation voltage. Very suitable for dc voltage 600V and above converter systems such as ac motor, inverter, switching power supply, lighting circuit, traction drive, and other fields.


IGBT is the core energy transformation and transmission device, commonly known as the CPU,of power electronic devices. As a national strategic emerging industry, IGBT is widely used in rail transit, smart grid, aerospace, electric vehicles, new energy equipment, and other fields.


Generally speaking, the current flowing through the IGBT module is large, and the switching frequency is high, which leads to the high loss of IGBT module devices and the high temperature of devices. However, the IGBT modules poor heat dissipation will cause damage and affect the whole machine's operation.Maybe the reasons for IGBT overheating is because of the drive waveform is not good, excessive current or switch frequency is too high, and may also be due to poor heat dissipation.


If the temperature is too high, the working efficiency of the module will decline, which will affect the whole working progress. Especially for those devices that need continuous work, the IGBT module is more dependent on, and an excellent cooling system is needed to ensure.


The most commonly used heat dissipation are passive fin heat dissipation and wind cooling heat dissipation: these heat dissipation methods are low cost, easy to use, and widely used. However, there are also many constraints. The heat accumulation is too large to dissipate in time, and the cooling effect quickly reaches the bottleneck. In this case, the IGBT module faces a big dilemma.


In this case, the new heat dissipation mode must replace the traditional heat dissipation mode. As a fast-developing way, water-cooled heat dissipation has been prominent in the field of heat dissipation in recent years. Water cooling uses the feature that the specific heat capacity of liquid is larger than that of air to absorb heat quickly and thoroughly.


After passing through the circulation system, it reaches cooling and exhaust and then returns to the waterway system. The cycle has been repeated to continue to heat if the peak heat can also be more leisurely to deal with.


With the progress and improvement of water cooling and heat dissipation technology, water cooling and heat dissipation are safer and more durable, and the cost is also reduced. Although installation and maintenance are a little inconvenient, water cooling technology is worth putting into use in the long run.

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