What are the IGBT module cooling methods?

When the power of the IGBT module is certain, the thermal resistance between the shells is certain. IGBT shell is related to the thermal resistance of the radiator, material and contact. The changes in the material and contact of the radiator and the amount of contact with the radiator have a small impact on the entire heat dissipation process.

There are 3 types of IGBT mold heat dissipation. The temperature rising temperature generated by the consumption of power equipment requires a reduction in the heat sink. Increase the thermal conductivity and radiation area of the power equipment through the radiator, expand the heat flow, and buffer the transition process of the cushion. Directly transmit or pass the heat to the cooling medium through the thermal transmission medium, such as the mixture of air, water and water. At present, the cooling methods commonly used are air natural cooling, forced air cooling, circulating water cooling, etc.

IGBT module heat dissipation process

1.IGBT combined with electricity loss

2. The combined temperature is transmitted to the IGBT module shell

3. The heating radiator of the IGBT module

4. The thermal conductivity on the radiator to the air

1. Natural cooling air

Natural air heat dissipation refers to the purpose of not using any external auxiliary energy to achieve the purpose of cooling the heat dissipation to the surrounding environment to control temperature control. It usually includes heat conduction, convection and radiation, which is suitable for low consumption equipment and components with low temperature control requirements and low heat flow density with low equipment. Sealing or densely assembled devices are not applicable to other cooling technologies. The radiator is low -efficiency and is not suitable for high -power equipment. Its structure is simple, no noise, no maintenance, especially no motion components. High reliability is suitable for components with a rated current.

2. Forced cooling

The characteristics of compulsory air cooling are high in heat dissipation, and the heat transfer coefficient is 2 to 5 times that of self -cold heat dissipation efficiency. Force, cold and cooling are mainly divided into two parts, which are winged heat sinks and fans. The function of the flaps that the heat source is directly exposed to, and its role is to lead to the heat from the heat source. It is mainly related to the material, structure and wings of the radiator. The larger the wind speed, the smaller the heat resistance of the radiator. However, the greater the flow resistance, the higher the wind speed should be increased to reduce thermal resistance. After the wind speed exceeds a certain value, it will increase the impact of wind speed on thermal resistance. The quality characteristics of the heat dissipation material have significant characteristics of heat dissipation efficiency.

Copper thermal coefficients are equivalent to twice the industrial pure aluminum. Under the same heat dissipation efficiency, the volume of the copper radiator is one -third to one -half of the aluminum radiator. The price of copper is high and generally applied less.

The wind and cold heat dissipation structure is simple, low in price, safe and reliable, and mature technology, but cannot reduce the temperature below room temperature. Because the wind turbine needs to be set up, the noise is large and easy to get vacuum, so the reliability is relatively reduced. With a certain amount of maintenance, the life span of the drumming device is subject to time limit.

3.IGBT water cooling cooling method

For power electronic devices with high power density, liquid cooling is a good choice. The liquid cooling system uses the circulating pump to ensure that the cooling liquid circulates between the thermal source and the cold source and exchange heat. The heat dissipation efficiency of the water -cooled radiator is extremely high, which is equal to 100 ~ 300 times that of the natural cooling and heat exchange coefficient of air. Use water cold instead of air cooling can greatly increase the capacity of the equipment. However, due to the poor insulation of ordinary water, the impurities in the water will cause electrical corrosion and leakage under high voltage. Only under low voltage can ordinary water be cooled. In order to enable the above water -cooled system to enter the field of high -voltage and high -power electronics, the purity of cooling water and the reliability and corrosion of the system during long -term runtime must be solved. The water cooling method requires water circulation and processing equipment.

Due to the coolness of the oil -cooled radiator than the air, installing the valve body in the fuel tank can avoid the impact of the environmental conditions in the fuel tank. It has high insulation and electromagnetic shielding effects. Therefore, it is widely used in high -voltage high -power electronics devices. However, the water cooling system has obvious advantages in terms of cooling effects and environmental impacts. In recent years, the oil -cooling system seems to gradually fade out of the field of heat dissipation in high -pressure high -power variables.

With regard to water cold plates, Winshare Thermal has professional customization capabilities for different systems. If you have any other questions about the cold plate or need a cooling solution for your cold plate, feel free to leave a comment or send an email to contact Winshare.