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Core advantages:
Process Breakthrough: Integrated Skived Fin Forming (eliminates contact thermal resistance, boosting heat dissipation response by 25%)
Structural Advantage: Dense-Thin Fin Structure (increases heat dissipation area by 40% compared to traditional solutions)
Material Superiority: AL1060/C1100 Grade Aluminum (thermal conductivity ≥201W/(m·K), excelling in both lightweight design and corrosion resistance)
High-Power Compatibility: Ideal for high-heat-flux scenarios (meets the thermal demands of lasers, computing centers, and intelligent driving domain controllers)
Core advantages:
Process Breakthrough: Integrated Skived Fin Forming (eliminates contact thermal resistance, boosting heat dissipation response by 25%)
Structural Advantage: Dense-Thin Fin Structure (increases heat dissipation area by 40% compared to traditional solutions)
Material Superiority: AL1060/C1100 Grade Aluminum (thermal conductivity ≥201W/(m·K), excelling in both lightweight design and corrosion resistance)
High-Power Compatibility: Ideal for high-heat-flux scenarios (meets the thermal demands of lasers, computing centers, and intelligent driving domain controllers)