Winshare Vapor Chamber Customization Service

Winshare Thermal Alloy: Extremely uniform temperature, ultra-thin and efficient, solving the challenge of high heat flux density.

What is vapor chamber?

A vapor chamber is an advanced planar heat transfer device that works similarly to a heat pipe but diffuses heat efficiently in a two-dimensional plane. It consists of a flat, closed chamber containing a small amount of working fluid and capillaries. When heat is applied to any point of the vapor chamber, the working fluid at that point quickly evaporates and absorbs heat, and the vapor quickly diffuses throughout the surface within the chamber and condenses and releases heat in the colder area. The condensed liquid flows back to the heat source through the internal capillary structure, completing a continuous phase change cycle.

The effective thermal conductivity of vapor chambers is much higher than that of traditional metal materials, especially in handling high heat flux density heat sources and achieving surface temperature uniformity. Due to their ultra-thin, efficient, and ability to customize complex shapes, vapor chambers are widely used in high-performance computing, smartphones, gaming graphics cards, high-power LEDs, and other fields where heat dissipation space is extremely limited but requires extremely high heat dissipation performance and temperature uniformity. It can effectively reduce local hot spot temperatures, improving equipment performance and reliability.

Core Composition and Advantages

Main components: flat closed cavity, internal capillary structure, small amount of working fluid.

Working principle: Two-dimensional plane heat diffusion using latent heat of phase change in working medium.

Thermal conductivity: The effective thermal conductivity is much higher than that of traditional metal materials, especially good at hot spot diffusion.

Operating characteristics: passive passive operation, ultra-thin design, high reliability.

Advantages and features of Winshare vapor chamber products

Ultimate 2D heat diffusion capability

The vapor chamber can quickly and uniformly diffuse the huge heat generated by local hot spots such as chips on the entire plane with a very low temperature difference, effectively solving the bottleneck of high heat flux density heat dissipation.

Ultra-slim design to fit into compact spaces

With its unique flat structure and advanced manufacturing process, vapor chambers can achieve ultra-thin thicknesses as low as 0.3mm, perfectly fitting smartphones, tablets, laptops, and other devices with strict space constraints.

Significantly improve equipment performance and reliability

Through efficient temperature equalization, it effectively reduces the junction temperature and hot spot temperature of the chip, thereby extending the life of electronic components and improving the stability and overall performance of equipment operation.

Highly customized shapes and functions

The vapor chamber can be customized according to the specific heat source size, power distribution, and internal structure of the device, such as arbitrary shapes, openings, and bends, to achieve seamless integration with the heat dissipation module.

Passive and maintenance-free

Vapor chambers require no external power or moving parts, rely on internal phase change cycles to work passively, with high reliability, no noise, no vibration, and virtually no maintenance.

Suitable for high heat flux density scenarios

It is especially suitable for scenarios where high concentrated heat needs to be quickly diffused over a larger area for heat dissipation, such as high-performance CPUs/GPUs, IGBT modules, and high-power LED arrays.

Vapor Chamber Working Principle

The core technical principle of the vapor chamber is in the same vein as the heat pipe, but its design is more focused on efficient heat diffusion and temperature equalization in a two-dimensional plane. The entire phase change heat transfer cycle takes place in a flat vacuum chamber

Evaporation

When a heat source (such as a high-power chip) touches the evaporation area of the vapor chamber, the working fluid (such as water) inside quickly absorbs heat and evaporates to form steam.

Vapor Spreading

The resulting vapor spreads rapidly within the chamber with a very low pressure difference, covering the entire interior of the vapor chamber and reaching the colder condensation area.

Condensation

The vapor touches the colder plate wall in the condensation area, transferring latent heat to an external radiator or cooling medium, and condensation returns to a liquid state.

Liquid Return
The condensed liquid passes through the wick structure inside the vapor chamber and uses capillary force to evenly flow back to the evaporation area, completing a closed two-dimensional cycle.

This rapid and continuous two-dimensional phase change cycle enables the vapor chamber to quickly and evenly diffuse the heat generated by local hot spots to the entire heat dissipation surface, thereby effectively reducing the hot spot temperature and improving heat dissipation efficiency and system stability.

What are the components of Winshare vapor chambers?

Vapor chambers may seem simple in structure, but their efficient operation relies on the precise design and synergy of the various components inside. Winshare vapor chambers are mainly composed of the following core components

Casing

Material: Typically made of copper (Copper) for its excellent thermal conductivity and good compatibility with hydraulic fluids. For specific applications, Stainless Steel (highly corrosion-resistant) or Aluminum Alloy (lightweight, with special inner wall treatment) are also available. Function: Forms a closed vacuum chamber that houses the working fluid and capillary structure and serves as an interface for heat input and output.Wick Structure

Dissimilar materials FSW potential

Types: Sintered (copper/nickel powder sintering), Multi-layered mesh (precision copper mesh pressing) and Composite. Function: The return of the condensed liquid from the condensation zone to the evaporation zone by capillary force is the key to the passive operation of the vapor chamber. Its porosity and structure determine the capillary pumping capacity and heat transfer limit of the vapor chamber.

Support Pillars

Function: Provides mechanical support between the upper and lower shells of the vapor chamber to prevent the shell from collapsing under the action of vacuum extraction and external pressure. At the same time, they also help maintain the space of the internal steam channel, ensuring the free flow of steam. Design: The distribution and density of the support columns have an impact on the overall structural strength and thermal properties of the vapor chamber. Working fluid: Efficiently transfers heat through latent heat through phase change during evaporation and condensation, and is the core medium for heat transfer of vapor chambers.

Working Fluid

Type: Selected according to the operating temperature range of vapor chambers, the most commonly used is Water (for 30°C to 200°C), in addition to Methanol (for low temperature environments) and Acetone (for low to medium temperatures). Function: Efficiently transfers heat through latent heat of phase change during evaporation and condensation, and is the core medium for heat transfer of vapor chambers.

Evacuation and Sealing

Function: Before charging the working fluid, the inside of the vapor chamber must be thoroughly evacuated to remove all non-condensable gases to ensure the pure phase change of the working fluid. This is followed by a permanent seal to prevent leakage of working fluid and the ingress of external gases. Important: Vacuum and tightness are key guarantees for the long-term reliability and performance of vapor chambers.

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Winshare vapor chambers: core product parameters and customization capabilities

Winshare's vapor chamber products offer a high degree of flexibility and customization to meet your specific application needs for ultimate thermal performance and space constraints. The following is the range of our design and manufacturing capabilities

Heat Spreading Capacity

It can handle heat flux densities > 500 W/cm² Quickly diffuses the localized high heat flow over the entire surface, effectively reducing the hot spot temperature.

Thickness Range

As thin as 0.3mm Meet the stringent space requirements of ultra-thin electronic devices for heat dissipation components.

Temperature Uniformity

Surface temperature difference < 5°C Ensure a highly uniform heat source surface temperature to improve chip performance and lifetime.

Operating Temperature

Covers 0°C to 200°C By selecting the right working fluid and material, it can accommodate a wide operating temperature range.

Size and shape customization

Maximum size 400mm x 300mm It can be customized according to the internal space of the equipment for arbitrary shapes, openings, bends, etc.

Surface treatment

Nickel plating, passivation, spraying, etc Available in a variety of finishes to enhance corrosion resistance, insulation, or aesthetics.

Winshare vapor chamber vs. heat pipe

Vapor chambers and heat pipes are both efficient phase change heat transfer elements, but there are significant differences in structure, performance, and applicable scenarios. Understanding these differences can help you choose the best thermal management solution.

Characteristic	Vapor Chamber	Heat Pipe
Basic form	Flat, two-dimensional planar structure	Cylindrical, linear structure
Heat transfer direction	2D Planar Diffusion (spreads hot spots across the surface)	1D linear transfer (transferring heat from one end to the other)
Thermal flux density handling capacity	Very high (good at handling highly concentrated heat sources)	High (but not as good as the local hot spot handling capacity of vapor chambers)
Uniform temperature effect	Excellent (highly uniform surface temperature)Ultra-thin (up to 0.3mm)	Good (mainly in axial transmission)
Thickness	Ultra-thin (up to 0.3mm)	Usually thicker (diameter 3mm-12mm)
Structural complexity	Higher (tightly sealed, internally supported)	Lower (relatively simple)
Cost	Higher	Lower
Typical applications:	High-performance CPU/GPU, smartphone SoC, gaming graphics card, high-power LED	Laptops, server radiators, industrial equipment, LED lamps

Winshare vapor chambers: customized services

In the face of increasingly complex thermal challenges in electronic devices, standardized solutions often struggle to meet specific needs. Winshare Thermal Alloy specializes in providing highly customized vapor chamber solutions, ensuring that our products are perfectly suited to your unique application scenarios, whether it's extreme space constraints, special heat flow distribution, or demanding performance metrics.

Exactly match your thermal management needs

Heat load and heat flux density optimization: Customize vapor chamber size, internal capillary structure, and working fluid fill based on your chip power and hot spot distribution for optimal heat diffusion efficiency.

Operating Temperature and Environmental Adaptability: Choose the working fluid and housing material that best suits your product's operating temperature range to ensure stable and reliable operation of vapor chambers in various harsh environments.

System Pressure Drop and Fluid Compatibility: For liquid-cooled vapor chambers, optimize the internal runner design to minimize fluid pressure drop and ensure the material is compatible with your coolant.

The perfect blend of structure and space constraints

Ultra-thin and special-shaped designs: Breaking through traditional limitations, we offer vapor chambers as thin as 0.3mm and can be customized to any shape, opening, bending, stepping, or multi-layer stacking according to your product's interior space.

Integrated Solution: Integrate the design and manufacture of vapor chambers with components such as cooling fins, fans, and mounting brackets, simplifying your assembly process and reducing overall costs.

Surface Treatment Customization: Various surface treatment options (e.g., nickel plating, passivation, spraying) are available to meet specific corrosion resistance, insulation, or aesthetic requirements.

Full support from prototype to mass production

Our customized services cover from initial proof of concept to final volume production. Winshare's team of engineers will work closely with you to quickly iterate on your design and deliver high-quality prototype samples using advanced CFD simulation and thermal testing platforms. Once the design is validated, our robust manufacturing capabilities will ensure that customized solutions are efficiently and consistently translated into large-scale batch products to meet your market demands.

Choosing Winshare means choosing a partner that can translate your unique thermal challenges into high-performance, high-reliability custom vapor chamber solutions.

Winshare vapor chambers: quality certification and assurance

Winshare Thermal Alloy has a strict commitment to the quality of vapor chambers. We have established a comprehensive quality management system and conduct multiple rigorous tests on each product to ensure its performance and long-term stability.

Rigorous factory testing

Thermal Diffusion Capability Testing: Accurately measure the heat diffusion efficiency of vapor chambers under local hotspot inputs.
Uniformity Testing: Evaluates the uniformity of the surface temperature of the vapor chamber.
Leak Test: High-precision equipment such as helium mass spectrometry leak detectors is used to ensure that the internal seal of the vapor chamber is leak-free.
Non-condensable gas test (NCG Test): Detects the presence of non-working fluid gases inside the vapor chamber that affect performance.
Life Cycle Test: Simulates long-term operating conditions to verify the durability and stability of vapor chambers.
Post-bending/profiled performance testing: Ensures that vapor chambers maintain their design properties after shape processing.
Our main certifications

ISO 9001:2015: Internationally recognized quality management system certification, covering the entire product life cycle.
IATF 16949: Quality Management System for the Automotive Industry to provide the highest guarantee for highly demanding areas such as automotive electronics.
ISO 14001:2015: Environmental Management System certification, reflecting our commitment to sustainability and eco-friendly manufacturing.
UL / CE / RoHS: Products comply with safety, health and environmental regulations in major markets around the world.

Winshare vapor chamber applications

High-performance computing

CPU, GPU, and AI chips dissipate heat

High-power LED lighting

stage lights, projectors, car lighting

Smartphones and tablets

SoC, 5G module heat dissipation

Automotive electronics

In-vehicle infotainment, power semiconductors

Gaming laptops and graphics cards

GPU, CPU cooling

Medical devices Diagnostic

Instruments, Laser Medical Equipment

Winshare vapor chamber manufacturing process

The manufacturing of Winshare vapor chambers is a highly sophisticated process that involves several advanced technologies and strict quality control to ensure the superior performance and reliability of the final product.

Shell precision machining

High-precision CNC equipment is used to process copper plates or other shell materials to form the upper and lower covers and internal support structures of vapor chambers, ensuring dimensional accuracy and surface finish.

Capillary preparation

Depending on the design requirements, high-performance capillaries are prepared through processes such as sintering metal powder or pressing multi-layer precision wire mesh, which is the key to liquid reflow of vapor chambers.

High vacuum precision sealing

In a cleanroom environment, the upper and lower shells and capillaries are tightly sealed through advanced vacuum brazing or diffusion welding techniques to form a completely enclosed vacuum chamber to ensure long-term airtightness.

Thorough vacuuming and precise charging

The encapsulated vapor chamber is thoroughly evacuated internally to remove all non-condensable gases. Subsequently, the calculated amount of working fluid is accurately charged and the final seal is performed.

Each vapor chamber is subjected to rigorous tests such as thermal

Diffusion capacity, temperature uniformity, air tightness, and non-condensable gas content to ensure that it meets design performance and reliability standards.

Why choose Winshare Thermal Alloy vapor chamber？

Professional vapor chamber design and manufacturing capabilities

We have an experienced vapor chamber design and manufacturing team that is proficient in the customization of various capillaries and complex shapes, and can provide the most optimal thermal management solution according to your needs.

Advanced production equipment and technology

Equipped with industry-leading vacuum brazing furnaces, diffusion welding equipment, and automated liquid-filled sealing systems, it ensures high precision and consistency in vapor chamber manufacturing processes, meeting the needs of large-scale mass production.

Strict quality control and testing

We strictly follow quality standards such as ISO and IATF, and conduct a number of rigorous tests on each vapor chamber such as heat diffusion capacity, uniformity, air tightness, and life to ensure stable and reliable product performance.

Comprehensive customization services

From vapor chamber selection, structural design, prototyping, to mass production, we provide one-stop, comprehensive customization services to ensure that the product is perfectly suited to your unique application.

Winshare vapor chambers: Frequently Asked Questions (FAQs)

Q What is the fundamental difference between vapor chamber and heat pipe?

A Common types include microchannels, needle fins, and high-density fins. Microchannels provide extremely high heat transfer area and efficiency for ultra-high heat flux densities with relatively large pressure drops. The needle fin structure can effectively disturb the fluid, taking into account both heat transfer and pressure drop. The high-density fins improve heat transfer by increasing the surface area, and the design is flexible. Winshare will recommend the most suitable runner structure based on your specific application needs, combined with thermal simulation and fluid dynamics analysis, to achieve optimal heat dissipation and system performance.
Q What is the thickness limit of vapor chamber?

A The material of a water block directly impacts its thermal conductivity, weight, cost, and compatibility with coolant. Copper, with its exceptional thermal conductivity (approximately 400 W/m·K), is the material of choice for high-performance water blocks but comes at a higher cost and is relatively heavy. Aluminum alloys (approx. 200 W/m·K) are lightweight and cost-effective for applications where weight and cost are critical. Choosing the right material also involves considering chemical compatibility with the coolant to prevent long-term corrosion or degradation in performance. Winshare will provide professional material selection advice.
Q What are the types of capillaries inside vapor chambers?

A Pressure drop refers to the pressure lost by the coolant as it flows through the internal flow channel of the water block. Excessive pressure drop can increase the load on the pump, leading to increased system power consumption, shortened pump life, and even affected coolant flow, thereby reducing overall heat dissipation efficiency. Winshare will comprehensively consider the balance between heat dissipation performance and pressure drop when designing water blocks, striving to meet heat dissipation needs while maintaining a low system pressure drop, and optimizing the energy efficiency and reliability of liquid cooling systems.
Q How do vapor chambers improve the reliability of electronic devices?

A The vapor chamber effectively reduces the maximum operating temperature and temperature gradient of the chip by quickly and evenly spreading the heat generated by local hot spots like the chip to a larger heat dissipation area. This reduces thermal stress and delays the aging of components, thereby significantly improving the long-term stability and reliability of electronic devices.

Contact us today to customize your temperature distribution solution.

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