Empowering Peak AI Performance Winshare Thermal AI Solutions

From cloud AI training clusters to edge computing devices, artificial intelligence is reshaping the world. Winshare Thermal provides comprehensive, highly reliable thermal solutions from chip to rack level, ensuring your AI hardware operates stably under extreme loads to unleash its full potential.

The Thermal Challenges Behind the AI Revolution

Higher compute density leads to unprecedented heat flux, and traditional cooling methods can no longer meet the demands of next-generation AI hardware.

Extreme Heat Flux (TDP)

The power consumption of AI GPUs and ASICs has surpassed 1000W, posing an extreme challenge to thermal systems with immense heat generated per unit area.

High-Density Deployment

To achieve higher computing efficiency, AI server racks are becoming more densely packed, leading to heat accumulation and multiplying cooling difficulties.

Performance & Reliability Risks

Inadequate cooling can cause thermal throttling, impacting AI model training and inference efficiency, and may shorten hardware lifespan, increasing operational costs.

A Matrix of Thermal Solutions for All AI Scenarios

We deeply understand the unique thermal needs of different AI applications, offering a full range of products from air to liquid cooling, from standard to deeply customized.

Flagship Solution: Liquid Cooling Technology

For flagship AI accelerators with TDPs exceeding 500W, liquid cooling is the only choice to ensure full performance. We offer industry-leading liquid cooling technologies, including:

Two-Phase Liquid Cooling

Designed for next-gen >1500W GPUs, providing ultimate thermal performance.

FSW/Brazed Cold Plates

Balancing high performance and reliability, suitable for mainstream AI training servers.

Custom Liquid Cooling Modules

Tailor-made for heterogeneous hardware like AI servers, switches, and OAM modules.

High-Efficiency Solution: Heat Pipe Modules

For space and cost-sensitive applications like AI inference servers and edge computing boxes, our heat pipe modules are the ideal balance of performance and efficiency.

High Thermal Conductivity

Rapidly transfers core heat to a large surface area of fins.

Flexible Structural Design

Customizable 3D shapes to fit motherboard layouts and airflow paths.

Mature Manufacturing

Ensuring the performance and long-term reliability of every heat pipe.

Cost-Effective Solution: High-Performance Air Coolers

We provide a diverse range of high-performance air cooling solutions for auxiliary heat sources in AI servers like CPUs, VRMs, storage, and network modules.

Skived/Extruded Fins

Cost-effective for large-scale, standardized cooling needs.

Stamped/Welded Fins

Offering greater design flexibility and larger heat dissipation areas.

Precision CNC Machining

Ensuring perfect contact with heat sources for minimal thermal resistance.

Our Success Stories

Real results are the most powerful proof of our expertise.

Solving GPU Overheating for a Cloud Giant

Challenge: A client's 1200W AI training servers experienced frequent GPU throttling under high load, impacting model training efficiency.

Solution: We custom-developed a high-performance FSW cold plate with an optimized internal micro-channel design.

Result:GPU core temperature was reduced by 15°C, performance increased by 20%, achieving zero-throttling stable operation year-round.

Enhancing AI Edge Device Reliability

Challenge: An AI startup's edge computing device could not effectively dissipate heat in a compact space, leading to poor product reliability.

Solution: We designed a 3D-shaped thermal module integrating micro heat pipes and a vapor chamber.

Result:Thermal efficiency increased by 35% with no change in volume, and the product's MTBF doubled.

Accelerating Autonomous Driving R&D

Challenge: An autonomous driving company's in-vehicle computing platform suffered from slow thermal design iterations, affecting R&D progress.

Solution: We provided an integrated "thermal simulation + rapid prototyping" service, cutting sample delivery from 4 weeks to 1 week.

Result: The client's thermal validation cycle was shortened by 70%, significantly accelerating their time-to-market.

Validated Solutions for Specific AI Hardware

We don't just understand the industry; we specialize in providing precisely matched thermal solutions for mainstream and next-generation AI hardware.

NVIDIA H100/B200 GPU

Custom cold plates provide precise coverage for the GPU die and HBM, effectively solving challenges of high TDP and uneven heat source distribution.

AMD Instinct MI300X

Advanced micro-channel design and FSW processes ensure uniform surface temperature for chiplet architectures, eliminating local hotspots.

AI OAM/UBB Modules

Providing OCP OAM standard-compliant liquid cooling solutions for modular, high-efficiency system-level cooling in dense server deployments.

Server Switches/DPUs

Compact, efficient thermal modules for high-heat network and data processing units, ensuring stable, high-speed data exchange in data centers.

Get a customized plan now

Why Partner with Winshare Thermal for AI Cooling

We offer more than products; we provide expert thermal services throughout your entire AI hardware development lifecycle.

Deep Industry Insight

We keep pace with AI hardware trends, deeply understanding the thermal needs of technologies like OAM, UBB, and HBM to offer forward-looking solutions.

Agile Customization

From thermal simulation and structural design to rapid prototyping, we quickly respond to your unique cooling needs to accelerate your time-to-market.

Proven Reliability & Quality

Backed by strict quality systems like IATF 16949 and comprehensive in-house testing, we ensure our products run stably under 24/7 high-intensity AI workloads.

Scalable Production Capacity

We have large-scale production facilities and automated lines capable of meeting the massive delivery demands of the booming AI server market.

Our Collaboration Process

We offer a clear, professional, and efficient collaboration process that seamlessly integrates with your R&D and production cycles.

Needs Analysis & Early

Engagement We engage early in your product design to jointly define thermal targets and technical paths.

Thermal Simulation & Design

Using advanced CFD tools for modeling and analysis to provide data-driven design solutions.

Rapid Prototyping & Validation

Leveraging agile manufacturing for fast sample delivery and full in-house lab performance validation.

Mass Production & Delivery

Relying on automated production lines and strict QC to ensure high-quality, on-time mass delivery.

Ready to Design the Thermal Solution for Your AI Hardware?

Contact our thermal experts today to discuss how we can create efficient, reliable, and cost-effective cooling solutions for your AI products. Let us help you stay ahead in the AI era.

Get an instant quote