Heat Conduction The heat generated by heat-generating devices (such as chips) is first efficiently conducted to the heat exchange surface inside the water block through the thermal interface material (TIM) and the bottom plate of the water block. This step is key to ensuring that heat can quickly enter the cooling system from the heat source.
Fluid entry and distribution
The coolant, typically deionized water, glycol aqueous solution, or specialized media, driven by an external water pump, enters the water block from the water inlet. Internally designed precision flow channels, such as microchannels, pin fins or high-density fins, ensure that the coolant flows evenly and efficiently through all heat exchange zones, avoiding local overheating.
Convection heat transfer
The coolant flows at high speed in the flow channel, and the inner wall of the water block conducts powerful convection heat transfer to quickly absorb heat. The design of the runner optimizes fluid distribution and turbulence, maximizes the heat transfer coefficient, and allows heat to be quickly carried away by the coolant.
Heat Exhaustion and Circulation
The coolant that absorbs heat rises in temperature, flowing out of the water block from the outlet and into other components of the liquid cooling circulation system (e.g., radiators, fans), where heat is dissipated into the environment. The cooled liquid is then driven by a water pump to recirculate back to the water block, forming a continuous, efficient closed loop of heat management.
This efficient heat transfer mechanism allows the water block to handle extremely high heat flux densities and maintain the heating device within a safe and stable operating temperature range, thereby significantly improving system performance, reliability, and service life.