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You are here: Home » Heatsink » Skived Fin Heat Sink » High Density Cu or Aluminum Skive Heatsink for High Power Heat Pipe IGBT Cooling Radiator

High Density Cu or Aluminum Skive Heatsink for High Power Heat Pipe IGBT Cooling Radiator

The High Density Skive Heatsink is engineered specifically for high-power applications, providing exceptional thermal management for IGBT devices and other power electronics. Utilizing advanced skiving technology, this heatsink maximizes heat dissipation efficiency while maintaining a compact form factor.
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Key Features

  • Material Options: Available in high-quality copper or aluminum, both offering excellent thermal conductivity.

  • Skived Design: Manufactured using a skiving process that creates thin, densely packed fins for superior heat dissipation.

  • High Aspect Ratio: The design allows for a high aspect ratio, enhancing the surface area available for cooling.

  • Integrated Heat Pipe Compatibility: Designed to work seamlessly with heat pipes, optimizing thermal performance in demanding applications.

  • Lightweight and Compact: The skived structure reduces weight without sacrificing performance, making it ideal for space-constrained environments.

How It Works

The skived heatsink operates by absorbing heat from the IGBT or other power devices through its base. The thin fins increase the surface area, allowing for efficient heat transfer to the surrounding air. This design minimizes thermal resistance and enhances airflow, ensuring effective cooling even under high load conditions.

Advantages

  • Rapid Thermal Response: Provides quick heat dissipation, crucial for high-power applications.

  • No Thermal Interface Resistance: As the fins are integral to the base, there are no additional thermal resistance interfaces that can hinder performance.

  • Cost-Effective Manufacturing: The skiving process requires minimal tooling costs and allows for rapid prototyping and customization.

  • Environmentally Friendly: Operates without requiring external power sources and is designed for safe and reliable use.

Applications

  • IGBT Cooling: Ideal for IGBT modules in industrial applications such as inverters and converters.

  • Power Electronics: Suitable for various power semiconductor devices requiring efficient thermal management.

  • Telecommunications Equipment: Effective in cooling systems used in communication infrastructure.

  • Automotive Applications: Used in electric vehicles and hybrid systems where efficient heat management is critical.

Customization Options

We offer customization to meet specific application requirements, including variations in size, fin height, and material finish. Contact us to discuss your unique needs.


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