Tel: +86-18025912990   |  Email: wst01@winsharethermal.com
cooling plates for electronics
Blog
Share the brilliance of winshare thermal with you for your joint witness
You are here: Home » News

AI Chip Cooling

The articles shown below are all about the AI Chip Cooling, through these related articles, you can get relevant information, notes in use, or latest trends about the AI Chip Cooling. We hope these news will give you the help you need. And if these AI Chip Cooling articles can't solve your needs, you can contact us for relevant information.
  • AI Chip Thermal Management: Cooling Solutions

    2025-07-25

    The rise of Artificial Intelligence (AI) has revolutionized countless industries, pushing the boundaries of computational power and data processing. From large language models and machine learning to autonomous vehicles and complex scientific simulations, AI chips (such as GPUs, TPUs, and specialize Read More
  • Hybrid Cold Plate Technology: Enhancing AI Chip Cooling with 2-Phase Thermal Transition

    2024-08-09

    With the rapid advancement of AI technology, cooling solutions for high-power consumption chips have become increasingly critical. This study explores the development and performance evaluation of hybrid cold plates, combining liquid cooling with two-phase thermal transition technology, providing a Read More
Leave a Message
Send a message

INDUSTRY

HEATSINK

LIQUID COLD PLATE

CONTACT US

Tel: +86-18025912990
Email: wst01@winsharethermal.com
Add: NO.19, xingfa road, Xingfu road, Qingxi Town, Dongguan City, Guangdong Province, China.
Copyright © 2005-2021 Guangdong Winshare Thermal Energy Technology Co., Ltd. All rights reserved