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Constructed from high-purity aluminum (6063, 6061, 6005, 6060, 7005) or copper, ensuring excellent thermal conductivity.
Fins are created using skiving technology, cutting thin layers from a solid block to form a single-piece heat sink with no joints or interfaces, maximizing heat transfer efficiency.
Single-piece design ensures perfect conductivity between base and fins, eliminating thermal resistance found in bonded or soldered heat sinks.
Aluminum: Anodization (8–25 μm), Powder Coating (60–120 μm), or custom finishes like electroplating, polishing, or sandblasting.
Copper: Anti-oxidant treatment, Nickel Plating, or other protective coatings to enhance durability.
Custom color options: Silver, black, white, bronze, champagne, green, gray, golden yellow, nickel, or tailored finishes.
Tailored dimensions to meet specific application requirements.
Embedded heat pipes for enhanced thermal performance.
Attachment methods like plastic push-pin attachments for easy installation.
Additional CNC machining for component accommodation or specific mounting needs.
Option to add thermal interface material for improved heat source connection.
100% Thermal Conductivity: Single-piece construction ensures no thermal resistance between base and fins, unlike traditional bonded or soldered heat sinks.
High Fin Density: Thin fins (0.2–0.8 mm) increase heat dissipation area, delivering 1.5–2 times better cooling efficiency than conventional heat sinks.
Forced Airflow Efficiency: Optimized for high airflow environments, offering superior cooling with lower weight and cost compared to liquid cooling solutions.
No Expensive Tooling: Each fin is cut using the same tool, enabling greater design flexibility and lower production costs.
Customizable Without Extra Costs: Ideal for unique applications without requiring costly custom tooling.
Short Lead Times: Rapid prototyping and minimal setup fees support both small-scale and mass production.
Scalability: High production capacity with cost control, suitable for large-scale applications.
Single-Piece Construction: Eliminates failure points from joints or bonds, ensuring long-term reliability.
Surface Treatments: Anti-oxidation and protective coatings extend service life and resist corrosion.
Environmentally Friendly: Excess material is recycled, reducing waste and supporting sustainability.
The Skived Plate-Fin Heat Sink is versatile and designed for industries with high thermal density and power dissipation requirements, including:
Power Electronics: Inverters, welding machines, power supply equipment.
Medical Devices: High-power medical equipment requiring reliable cooling.
Communication: Telecommunication equipment, servers, data centers.
Industrial Control: Industrial machinery and control systems.
LED Lighting: High-power LED applications needing efficient heat dissipation.
Automotive: Electric vehicle components and automotive electronics.
Satellite and Aerospace: Equipment requiring high reliability in extreme conditions.
Other Applications: Thermoelectric coolers/generators, IGBT/UPS cooling systems, and high-heat electronic components like LEDs and transistors.
With over a decade of expertise in thermal management, Winshare Thermalloy is a trusted leader in the industry. Our skived fin technology has matured through large-scale applications, enhanced by advanced automation for superior cost-effectiveness and reliability. Endorsed by global customers such as Fujitsu, BYD, and Ocean Electric, our Skived Plate-Fin Heat Sink delivers unmatched performance and quality. Whether you need a standard solution or a fully customized design, Winshare Thermalloy is your partner for innovative thermal management solutions.
Constructed from high-purity aluminum (6063, 6061, 6005, 6060, 7005) or copper, ensuring excellent thermal conductivity.
Fins are created using skiving technology, cutting thin layers from a solid block to form a single-piece heat sink with no joints or interfaces, maximizing heat transfer efficiency.
Single-piece design ensures perfect conductivity between base and fins, eliminating thermal resistance found in bonded or soldered heat sinks.
Aluminum: Anodization (8–25 μm), Powder Coating (60–120 μm), or custom finishes like electroplating, polishing, or sandblasting.
Copper: Anti-oxidant treatment, Nickel Plating, or other protective coatings to enhance durability.
Custom color options: Silver, black, white, bronze, champagne, green, gray, golden yellow, nickel, or tailored finishes.
Tailored dimensions to meet specific application requirements.
Embedded heat pipes for enhanced thermal performance.
Attachment methods like plastic push-pin attachments for easy installation.
Additional CNC machining for component accommodation or specific mounting needs.
Option to add thermal interface material for improved heat source connection.
100% Thermal Conductivity: Single-piece construction ensures no thermal resistance between base and fins, unlike traditional bonded or soldered heat sinks.
High Fin Density: Thin fins (0.2–0.8 mm) increase heat dissipation area, delivering 1.5–2 times better cooling efficiency than conventional heat sinks.
Forced Airflow Efficiency: Optimized for high airflow environments, offering superior cooling with lower weight and cost compared to liquid cooling solutions.
No Expensive Tooling: Each fin is cut using the same tool, enabling greater design flexibility and lower production costs.
Customizable Without Extra Costs: Ideal for unique applications without requiring costly custom tooling.
Short Lead Times: Rapid prototyping and minimal setup fees support both small-scale and mass production.
Scalability: High production capacity with cost control, suitable for large-scale applications.
Single-Piece Construction: Eliminates failure points from joints or bonds, ensuring long-term reliability.
Surface Treatments: Anti-oxidation and protective coatings extend service life and resist corrosion.
Environmentally Friendly: Excess material is recycled, reducing waste and supporting sustainability.
The Skived Plate-Fin Heat Sink is versatile and designed for industries with high thermal density and power dissipation requirements, including:
Power Electronics: Inverters, welding machines, power supply equipment.
Medical Devices: High-power medical equipment requiring reliable cooling.
Communication: Telecommunication equipment, servers, data centers.
Industrial Control: Industrial machinery and control systems.
LED Lighting: High-power LED applications needing efficient heat dissipation.
Automotive: Electric vehicle components and automotive electronics.
Satellite and Aerospace: Equipment requiring high reliability in extreme conditions.
Other Applications: Thermoelectric coolers/generators, IGBT/UPS cooling systems, and high-heat electronic components like LEDs and transistors.
With over a decade of expertise in thermal management, Winshare Thermalloy is a trusted leader in the industry. Our skived fin technology has matured through large-scale applications, enhanced by advanced automation for superior cost-effectiveness and reliability. Endorsed by global customers such as Fujitsu, BYD, and Ocean Electric, our Skived Plate-Fin Heat Sink delivers unmatched performance and quality. Whether you need a standard solution or a fully customized design, Winshare Thermalloy is your partner for innovative thermal management solutions.