5G Communication Network Thermal Solution

Recently, the concept of "metaverse" has become popular, becoming the focus of public opinion and a hot new future scene.

Industry experts believe that the 7-layer elements for building the Metaverse are, from outside to inside (from shallow to deep),

experience, discovery, creator economy, spatial computing, decentralization, human-computer interaction, and infrastructure.

Among them, infrastructure is the premise and necessary condition to realize the development of other elements. Metaverse's

infrastructure includes 5G communication network infrastructure, chips, cloud computing, edge computing, blockchain, etc.

Specifically, the low latency and synchronization of the Metaverse require the support of 5G communication technology.

Driven by the development of 5G communications, many industries have made significant technological breakthroughs, and the

Internet of Things (IoT) is one of the critical industries. In the past 4G era, many home appliances and mobile devices have

been connected in series, but due to technical difficulties such as limited 4G communication bandwidth and data transmission,

the development of IoT has been prolonged;

Fueled by the amount of transmitted data, IoT has become a popular research topic and future development direction. As a professional high power heatsink manufacturer, Winshare thermal

uses Ansys thermal simulation software to provide corresponding and detailed

solutions for 5G and IoT and produce various types of radiators that meet the needs. Among them, the most cost-effective.

process is the Skived fin process.

In response to the needs of IoT devices, Ansys provides several solutions to realize the design of IoT devices in the 5G environment.

There are corresponding design processes from antennas systems to environmental simulations. First of all, Ansys HFSS has a 3D

component array from the antenna side to accelerate the design of 5G array antennas. Secondly, Ansys HFSS provides an automation

platform on the system side and uses the script function to automate and optimize the design. Finally, SBR+ in Ansys HFSS provides

a large-scale environmental simulation platform for device usage scenarios, which can simulate the integration and design of the system

with the surrounding environment. For the thermal problems caused by high-speed transmission, Icepak and HFSS, the special software for Ansys electronic heat dissipation analysis, can complete the electro-thermal coupling simulation under a single platform and obtain the electromagnetic analysis under the influence of heat, which is closer to the natural environment.