Thermal Solution For 800W Laser Cooling Project

Heat pipe heat sink, Thermal Solution for 800W Laser cooling project.

The design requirements:

LD1 power: 6*70W=420W;

LD2 power: 1*35W=35W;

LD3 power: 1*13W=13W;

MOS chipsets: 8 group*30=240W;

Fans: PF92252V1-1000C-A99 X3pcs

Heat sink: Extrusion process

The pump source LD temperature should not exceed 55 degree(temperature difference less than

15 degree) when tested in a 40 degree  environment.

 3D design model in Creo

Orient positive X,Y,Z

Orient positive X,Y,Z

LD4, LD5, LD6 Temperature and MOS chipsets distribution

The results:

The module adopts the simple model method, the result and the actual will be different.

These LD power is about 55-57 degree.

MOS Chepsits: 59-83 degree.