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  • 3D VC Thermal Solutions: Next-Gen Heat Transfer

    2025-07-30

    The relentless pursuit of higher performance in electronic devices, especially in areas like AI, gaming, and data centers, has pushed power densities to unprecedented levels. This concentration of heat in ever-shrinking footprints poses a formidable challenge for traditional thermal management solut Read More
  • Why Heat Sinks Have Fins?

    2025-07-11

    Electronics today are smaller, faster, and more powerful than ever before. This incredible progress, however, comes with a significant challenge: managing the heat they generate. Excessive heat can degrade performance, shorten lifespan, and even lead to catastrophic failure for sensitive components Read More
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